400-863-9100

Aifotec AG(德国)

https://aifotec.de/?lang=en

地址:
Holzmarkt 5 07743 Jena Germany
电话:
+49 36938 81 31 75
传真:
+49 36938 81 31 76
产品:
硅光子学  半导体制造设备 

公司简介

Aifotec AG是一家德国公司,主要业务是在电信和数据通讯领域为客户提供高精度的装配设计方案及服务。


技术能力

Laser-Based Spot Size Eutectic Bonding

Aifotec’s laser-based spot size bonding provides precise passive assembly of up to ± 0.5 μm @ 3 sigma. The advantage of our technology is as follows: The local heat penetration through the laser system guarantees a very fast eutectic bonding process with little oxide formation and low heat impact on neighbouring fields

Technical Specifications:

  • Fast heating up times due to powerful laser

  • Variable size and shape of the laser spot

  • Adjustable temperature profiles up to 850°C

  • Heatable tool up to 350°C

  • Bonding force of 3 g-5000 g

  • Adjustable process gas

  • Device holder by Waffle Pak and Gel Pak or Blue Tape

  • Individual components through to wafers

  • Individual pickup tools allow for a large selection of components

  • Flip chip capability

  • Post-bond accuracy measurement

  • Shear force measurement

  • Wafer mapping

  • Data tracking


Heat Plate-Based Eutectic Bonding

The eutectic bond through our heat plate system offers our customers the option to assemble even very large components with an accuracy of ± 1.5 μm.

Technical Specifications:

  • Active alignment of planarity by interferometer measurement

  • Large heating plate of up to 2.5″

  • Adjustable temperature profiles up to 400°C

  • Bonding force of 30 g-150 g

  • Adjustable process gas, formic acid or forming gas

  • Pickup from Waffle Pak and Gel Pak

  • Individual pickup tools allow for a large selection of components

  • Post-bond accuracy measurement

  • Shear force measurement

  • Wafer mapping

  • Data tracking


Epoxy Bonding

Epoxy technology using a light-curing or conductive epoxy, as well as passive or active adjustment allow for multiple component assembly options.

Technical Specifications:

  • Fast curing times due to powerful UV unit

  • Dosing systems with different tools

  • Bonding force of 30 g-150 g

  • UV-curing epoxy

  • Heat-curing epoxy

  • Individual pickup tools allow for a large selection of individual components

  • Post-bond accuracy measurement

  • Adjustable process gas

  • Shear force measurement

  • Wafer mapping

  • Data tracking


Fibre Coupling

Aifotec realises the active optical coupling of individual fibres or fibre arrays to your chip.
The active coupling is realised with the optical cables using a technology patented by Aifotec with the smallest external dimensions.

Technical Specifications:

  • Active alignment and coupling

  • Customised substrate and fibre holder

  • Light-curing epoxy bonding with UV source 

  • Wavelength measurement

  • Polarisation measurement

  • Performance measurement

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