公司简介
Aifotec AG是一家德国公司，主要业务是在电信和数据通讯领域为客户提供高精度的装配设计方案及服务。
技术能力
Laser-Based Spot Size Eutectic Bonding
Aifotec’s laser-based spot size bonding provides precise passive assembly of up to ± 0.5 μm @ 3 sigma. The advantage of our technology is as follows: The local heat penetration through the laser system guarantees a very fast eutectic bonding process with little oxide formation and low heat impact on neighbouring fields
Technical Specifications:
Fast heating up times due to powerful laser
Variable size and shape of the laser spot
Adjustable temperature profiles up to 850°C
Heatable tool up to 350°C
Bonding force of 3 g-5000 g
Adjustable process gas
Device holder by Waffle Pak and Gel Pak or Blue Tape
Individual components through to wafers
Individual pickup tools allow for a large selection of components
Flip chip capability
Post-bond accuracy measurement
Shear force measurement
Wafer mapping
Data tracking
Heat Plate-Based Eutectic Bonding
The eutectic bond through our heat plate system offers our customers the option to assemble even very large components with an accuracy of ± 1.5 μm.
Technical Specifications:
Active alignment of planarity by interferometer measurement
Large heating plate of up to 2.5″
Adjustable temperature profiles up to 400°C
Bonding force of 30 g-150 g
Adjustable process gas, formic acid or forming gas
Pickup from Waffle Pak and Gel Pak
Individual pickup tools allow for a large selection of components
Post-bond accuracy measurement
Shear force measurement
Wafer mapping
Data tracking
Epoxy Bonding
Epoxy technology using a light-curing or conductive epoxy, as well as passive or active adjustment allow for multiple component assembly options.
Technical Specifications:
Fast curing times due to powerful UV unit
Dosing systems with different tools
Bonding force of 30 g-150 g
UV-curing epoxy
Heat-curing epoxy
Individual pickup tools allow for a large selection of individual components
Post-bond accuracy measurement
Adjustable process gas
Shear force measurement
Wafer mapping
Data tracking
Fibre Coupling
Aifotec realises the active optical coupling of individual fibres or fibre arrays to your chip.
The active coupling is realised with the optical cables using a technology patented by Aifotec with the smallest external dimensions.
Technical Specifications:
Active alignment and coupling
Customised substrate and fibre holder
Light-curing epoxy bonding with UV source
Wavelength measurement
Polarisation measurement
Performance measurement
