公司简介
Centerline Technologies was founded in 2005 by Hugh Muffoletto to meet the growing demand for high-quality, ultra-precision surface finishing in the telecommunication, semiconductor, communication, micro-electronic, defense and security markets.
技术能力
Lapping
Customizable processes to meet specific needs. We use both single sided polishing and double sided applications. | Polishing
Centerline provides both mechanical and CMP (chemical mechanical process) polishing techniques depending on the customer’s requirements. | Filled Via Planarity
Centerline can make filled vias co-planar with the surface of the substrate using either a one or two step process. |
Wafer Dicing
Centerline Technologies is capable of scribing or dicing a variety of shaped parts and finishing with diamond machined edges, bevels and chamfers. | Laser Machining
Centerline's laser machining services size the jobs according to specifications. | Specialty Processes
For all unique or difficult projects, Centerline works to find the right processes. |
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