400-863-9100

Buellton Advanced Materials Div. of Lockheed Martin Corp(美国)

https://www.lockheedmartin.com/en-us

地址:
153 Industrial Way Buellton, CA 93427 United States
电话:
+1 805-686-4235
传真:
产品:
增透膜 

公司简介

Provides thin-film coating employing multiple PVD techniques. Types of coatings include infrared (SWIR to LWIR), resistive, EMI, RFI, static, dissipative, transparent conductive, and patterned. Chambers to 14 ft length, pattern generation types, photolithographic (etch back and lift off, dry etch, shadow mask).


技术能力

Electron Beam (With Flip Tool)

Electron Beam (With Flip Tool)

Buellton Advanced Materials PVD Coatings

Electron Beam

Our chambers have multi-hearth sources allowing for multiple materials to be deposited without having to break vacuum to atmosphere and to be applied in one continuous process. Specialized chambers allow 360 degree coating coverage, also equipment setup with specialized tooling to allow for coating of two sided substrates without breaking vacuum. BAM's larger coaters are setup with 5 and 6 electron beam guns respectively for large area highly uniform coating coverage

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QC Product Inspection

Thermal Evaporation

Utilizing a resistance heater to melt the material and raise its vapor pressure to a useful range. Useful for materials that may disassociate using electron beam deposition - such as ZnS, YF3.

Sputter

Our sputter tools are configured to deposit  up to three material types per coating run without breaking vacuum, providing the best quality of film stack. BAM has a dedicated Indium Tin-Oxide tool that can deposit highly optically transparent ITO onto plastic as low as 15 ohm's/square and at near ambient temperatures, allowing us to apply this type of film without distorting or damaging the plastic.

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Parabola Metallization

General Coating Capabilities

Flex/Kapton

Substrates: Kapton, multilayer flex
Typical uses: EMI/RFI Shielding - Emissivity
Typical coatings: VDA (vapor deposited aluminum) & VDG (vapor deposited gold)

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PVD Coating Line

Ceramic Metallization

Typical ceramics: AlO, AlN, BeO
Typical metals: Adhesion layer: Chromium, Titanium, Titanium-Tungsten,
                     Barrier layer: Nickel, Platinum
                     Conductor layer: Gold, Copper, Silver

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Specialized Tooling (360 Degree Coverage)

Eutectic and Solder Metallization

Au/Sn, In/Cu, Au/Ge, In
Others inquire

Rigid: Composite/Plastics

Typical substrates: Astroquartz, PEEK, ULTEM
Typical uses: EMI/RFI Shielding - Emissivity
Typical coatings: VDA (vapor deposited aluminum) & VDG (vapor deposited gold)

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Large Area Coatings (High Volume/Large Parts)

TCO: Transparent Conductive Oxides

Standard material: ITO (Indium Tin-Oxide)
Typical substrates: Glass / Plastics
Range of resistance:  <10 Ω/ □ – 500 Ω/ □   (15 Ω/ □  on plastic)

Compound Curves and 360° Wrap Around Coated Parts

Typical substrates: No typical substrates (non-symmetrical shapes)
Uniformity: BAM Proprietary processes and unique fixturing offer superior uniformity as compared to standard TF processes.  

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Large Area Coatings

Optical Coatings

Wavelengths: SWIR - LWIR typical 1 – 14µm (2016 / 2017 Capa


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