公司简介
Designs, develops and manufactures quantum cascade lasers. Manufacturing facilities include multiwafer MOCVD growth machines, as well as associated characterization and wafer processing equipment.
产品列表
Laser Specifications
Chip- on – Submount | |||
MWIR DFB | LWIR DFB | ||
HHL Packaged Devices | |||
MWIR DFB | LWIR DFB | HIGH - POWER | |
TO3 & VHL Packaged Devices | |||
MWIR DFB | LWIR DFB |
Packaging Options
C-MOUNT:
c-mounting is available for low- to mid-power lasers
HHL PACKAGE:
The HHL is a hermetically sealed package that includes a temperature sensor, TEC, and collimating optics
VHL PACKAGE:
The VHL is a top emitting hermetically sealed package that includes a temperature sensor and TEC. The laser output is not collimated.
TO3 PACKAGE:
The TO-3 is a top emitting hermetically sealed package that includes a temperature sensor and TEC. Designed for low-power lasers and pulsed operation.